Jiesheng Transmission's Micro and Miniature Ball Screws Empower Precision Upgrades in Semiconductor and Electronics Manufacturing
Introduction
As semiconductor manufacturing processes advance toward the nanoscale and 3C electronic products evolve toward miniaturization and high integration, downstream production and testing equipment impose extreme demands on the size, precision, and cleanliness of transmission components. As the core transmission components of precision positioning mechanisms, micro-ball screws are widely used in key processes such as wafer handling, chip die bonding, electronic assembly, and dispensing and inspection. Their tiny size, micron-level precision, and low-particle-emission characteristics form the cornerstone for achieving precision in high-end electronic and semiconductor equipment.
In the microscopic processes of semiconductor and electronics manufacturing, even the slightest error in the transmission system can directly result in component scrap: wafer alignment deviations cause lithography misalignment, die bonding feed deviations lead to chip displacement, and dispensing stroke deviations result in non-conforming adhesive paths. Thanks to the high precision, low friction, and long service life inherent in rolling motion, micro and miniature ball screws have replaced traditional sliding transmission structures, becoming the preferred transmission solution for small precision equipment. For semiconductor and electronic equipment, reliable micro and miniature ball screws serve as the unseen core that ensures process yield and enhances equipment competitiveness.
Section I: Micro and Miniature Ball Screws: The Precision Transmission Core of Microelectronics Processes
In applications such as semiconductor wafer processing, chip packaging and testing, and precision assembly of 3C electronics, equipment is characterized by limited installation space, short travel ranges, high positioning accuracy requirements, and clean operating environments. Micro and nano ball screws convert rotational motion into linear motion through ball rolling, enabling high-precision feed control within extremely compact installation spaces. They are indispensable core transmission components in micro-precision equipment.
Four Core Values
Micrometer-Level Positioning Accuracy Ensures Process Yield: High-precision micro-miniature ball screws achieve micrometer-level or even sub-micrometer-level positioning and repeatability accuracy. By strictly controlling axial backlash, they ensure precise and controllable displacement in precision processes such as wafer alignment, chip mounting, and optical inspection. This effectively reduces product defects caused by transmission errors and significantly improves the production yield of electronic components and chips.
Miniaturized Design for Tight Spaces: With micro-sized specifications measuring just a few millimeters in diameter, paired with a compact nut design, these ball screws can be seamlessly integrated into confined installation spaces such as small modules, inspection equipment, and placement mechanisms. They align with the trend toward miniaturization and lightweight design in the semiconductor and 3C electronics industries, enabling high-precision linear motion within limited spaces and facilitating the development of more compact equipment.
Low-dust, clean design suitable for cleanrooms: To meet the stringent requirements of semiconductor cleanrooms, the system employs cleanroom-grade grease and sealing structures. During operation, no metal particles are shed, and grease evaporation is minimal, meeting Class 1000 and higher cleanliness standards. This prevents particle contamination of wafers and chips by transmission components, ensuring the environmental cleanliness required for semiconductor production.
Stable High-Frequency Operation, Enhancing Production Efficiency The low-friction rolling transmission structure features low starting torque and fast response times, making it suitable for the frequent start-stop cycles and rapid alignment operations typical of electronics manufacturing. The combination of wear-resistant steel balls, hardened raceways, and long-lasting lubrication supports extended continuous equipment operation, with slow precision degradation and extended maintenance intervals, helping electronics production lines improve production cycle times and equipment utilization rates.
Section II: Jiesheng Transmission Micro and Miniature Ball Screws: Precision Engineering Tailored to the Demanding Conditions of Microelectronics
Jiesheng Transmission specializes in the manufacturing of precision linear motion components. Addressing the miniaturization, high-precision, and cleanliness requirements of the semiconductor and electronics manufacturing industries, the company has developed a full range of micro and small ball screws covering all sizes from φ3 to φ16. The product line includes various nut configurations-such as single-nut, double-nut, flanged, and round-to perfectly meet the motion control needs of all types of micro-precision equipment.
Comprehensive coverage of micro and small sizes, with multiple precision grades available
Standard models cover the full diameter range from φ3 to φ16, with lead options ranging from 1 mm to 10 mm, meeting the requirements of equipment with varying feed rates and installation spaces. Precision grades range from C7 (cold-rolled) to C5 (ground), with high-end precision models reaching C3 grade. Models can be flexibly selected to meet the precision requirements of different operating conditions-such as semiconductor testing and electronic assembly-balancing performance and cost.
Low-backlash preload structure for precise and controllable positioning
Preload options are available; the preload between the steel balls and raceways eliminates axial clearance, significantly reducing transmission backlash and enhancing positioning accuracy and repeatability. For alignment applications involving high-frequency forward and reverse rotation, the preload structure effectively prevents reverse dead zones, ensuring precise direction-change positioning. This makes it suitable for scenarios with high reverse-direction accuracy requirements, such as chip mounting and vision-based alignment.
Clean Lubrication Configuration, Suitable for Dust-Free Production Environments
For semiconductor cleanroom applications, we offer customizable clean-grade grease filling paired with a low-friction sealing structure. This ensures low dust generation and no oil splatter during operation, meeting the requirements of Class 100 and Class 1,000 cleanrooms. Additionally, the low-wear design minimizes the generation of metal particles, preventing contamination and damage to precision components such as wafers and chips.
Customized End-of-Shaft Finishing: Ready for Installation Without Secondary Machining
Based on customers' equipment installation requirements, we offer a full range of finishing services for shaft ends, including turning steps, face milling, drilling, tapping, and grooving. We strictly control machining concentricity and geometric tolerances, allowing customers to directly install the shafts into bearing housings and motors upon receipt without the need for secondary machining. This significantly lowers assembly barriers and reduces the risk of precision deviations.
Section III:Comprehensive Coverage, Empowering the Entire Semiconductor and Electronics Manufacturing Process
Thanks to their compact size, high precision, and clean-room compatibility, Jiesheng Transmission's micro and miniature ball screws can be widely applied to various precision equipment across the entire semiconductor and electronics manufacturing industry chain, providing tailored drive solutions for the specific operating conditions of different manufacturing processes.
Semiconductor Wafer Processing and Inspection Equipment: Compatible with wafer lithography systems, coating and developing machines, wafer probe stations, optical inspection equipment, and more, these products are used in mechanisms such as wafer transfer, precision alignment, and inspection platform feeding. Their high precision and low-particle-emission characteristics make them suitable for nanoscale processes and cleanroom environments, ensuring precise and stable wafer processing and inspection.
Chip Packaging and Die Attachment Equipment: Designed for packaging equipment such as die attachers, wire bonders, pick-and-place machines, and molding presses, these solutions are used in operations including chip pickup, wire bonding alignment, and molding press feeding. Micrometer-level positioning accuracy ensures precise chip placement and reliable wire bonding positions, significantly improving packaging yield and meeting the precision requirements of high-end chip packaging.
3C Electronics Precision Assembly Equipment: Compatible with 3C production lines-including mobile phone component assembly machines, camera module placement machines, and connector pin insertion equipment-and used in mechanisms for precision transfer, accurate press-fitting, and alignment assembly; its compact size fits the space-constrained structures of 3C equipment, maintaining stable precision during high-frequency operation, thereby enabling 3C production lines to achieve high-cycle, high-precision mass production.
Precision Dispensing and Coating Equipment: Designed for high-speed dispensers, underfill machines, and coating/spraying equipment, these systems are used for Z-axis feeding of dispensing valves and XY-axis movement of worktables; smooth feeding motion ensures uniform adhesive flow and consistent coating thickness, preventing issues such as adhesive breakage or uneven bead width, and is suitable for precision dispensing applications such as underfill and edge sealing.
PCB/FPC Precision Processing Equipment: Compatible with PCB exposure machines, FPC laser cutters, and circuit inspection equipment, among others. These systems are used for circuit alignment, platform feeding, and inspection scanning. High-precision drive systems ensure uniform circuit line widths and precise alignment, meeting the microfabrication and inspection requirements for flexible circuit boards and high-density PCBs.
Micro-Motor and Component Production Equipment: Suitable for micro-motor assembly machines, inductor winding machines, component inspection and sorting machines, and more, used for the precise feeding, positioning, and inspection of tiny parts; micro-sized ball screws fit into the limited installation space of small equipment, and stable transmission accuracy ensures consistency in the assembly and inspection of micro-components.
Section IV: One-Stop Integrated Supply, End-to-End Quality AssuranceIntegrated Supply Reduces Procurement Costs
As a manufacturer of transmission components at the source, Jiesheng Transmission not only offers a full range of micro and small ball screws but also provides one-stop integrated supply solutions combining micro and small ball screws, micro linear guides, support brackets, micro locking nuts, and linear shafts. All core components are manufactured in-house with unified quality control, ensuring superior dimensional compatibility. Customers do not need to coordinate with multiple suppliers for component selection, significantly reducing communication costs and compatibility risks.
End-to-End Quality Control for Consistent and Reliable Quality
From material verification upon raw material arrival, raceway quenching and hardening, and precision grinding to full precision inspection of finished products, every micro and sub-micro ball screw undergoes end-to-end quality traceability. Key parameters are 100% inspected to ensure that delivered products meet precision standards and deliver stable performance. Additionally, we provide technical support-including screw selection, lead matching, and operating condition verification-based on customers' equipment design requirements to help them select the optimal transmission solution.
Flexible Delivery Mechanisms Tailored to Industry Needs
To address the procurement characteristics of the semiconductor and electronics industries-which involve multiple product varieties, small batches, and customization-we maintain a stock of standard models for rapid sample testing. We respond swiftly to customized, value-added processing orders and can schedule production on demand to ensure timely delivery. All products come with comprehensive after-sales warranties, and our professional technical team provides full-cycle support to help customers smoothly advance their equipment R&D and mass production.
Conclusion
From micro-transmission components to comprehensive precision transmission solutions, Jiesheng Transmission has always centered its operations on precision manufacturing. We focus on the miniaturization and high-precision transmission needs of the semiconductor and electronics manufacturing sectors, continuously refining product accuracy and reliability. Moving forward, we will keep pace with the advancement of the microelectronics industry, continuously iterating on micro-scale product technologies to provide global high-end electronics equipment customers with more stable and cost-effective precision transmission solutions.